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Effect of dopants on chemical mechanical polishing of silicon

✍ Scribed by M Forsberg; N Keskitalo; J Olsson

Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
238 KB
Volume
60
Category
Article
ISSN
0167-9317

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✍ Woong Cho; Yoomin Ahn; Chang-Wook Baek; Yong-Kweon Kim πŸ“‚ Article πŸ“… 2003 πŸ› Elsevier Science 🌐 English βš– 485 KB

The effects of polishing pressure and abrasive on the chemical mechanical polishing of blanket and patterned aluminum thin films were investigated. The CMP process experiments were conducted using a soft pad and slurry mainly composed of acid solution and Al O abrasive. The result of the blanket fil