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Effect of applied potential and surface dissolution on the creep behavior of copper

✍ Scribed by R.W. Revie; H.H. Uhlig

Book ID
116058172
Publisher
Elsevier Science
Year
1973
Weight
61 KB
Volume
7
Category
Article
ISSN
0036-9748

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πŸ“œ SIMILAR VOLUMES

The effect of surface dissolution on the
The effect of surface dissolution on the creep rate of copper
✍ C.J. Van Der Wekken πŸ“‚ Article πŸ“… 1977 πŸ› Elsevier Science βš– 760 KB

Accelerated creep rates of copper single crystal specimens were measured during anodic dissolution in acetate buffer solutions at various temperatures in the range from 10 to 4O'C. Delay times are not strongly temperature dependent. Under conditions of constant stress, achieved by compensating for t