The effect of surface dissolution on the creep rate of copper

✍ Scribed by C.J. Van Der Wekken

• Publisher: Elsevier Science
• Year: 1977
• Weight: 760 KB
• Volume: 25
• Category: Article
• ISSN: 0001-6160
• DOI: 10.1016/0001-6160(77)90208-5

✦ Synopsis

Accelerated creep rates of copper single crystal specimens were measured during anodic dissolution in acetate buffer solutions at various temperatures in the range from 10 to 4O'C. Delay times are not strongly temperature dependent. Under conditions of constant stress, achieved by compensating for the reduction in the specimen cross section during dissolution by proportionally reducing the load on the specimen, the effect largely disappeared in single crystals as well as in polycrystalline wire specimens. The data do not support an explanation based on divacancy production at the surface. Models attributing the effect to removal of a surface layer with special mechanical properties must also be rejected. It is concluded that accelerated creep rates during anodic dissolution under a constant load are essentially due to the increasing stress. The magnitude of the effect and the delay times involved are related theoretically to the vtscopiastic properties of the metaf.