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The effect of low stresses on creep and surface profiles of thin copper wires

โœ Scribed by V Srivastava; K.R McNee; H Jones; G.W Greenwood

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
175 KB
Volume
51
Category
Article
ISSN
1359-6454

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The effect of surface dissolution on the
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โœ C.J. Van Der Wekken ๐Ÿ“‚ Article ๐Ÿ“… 1977 ๐Ÿ› Elsevier Science โš– 760 KB

Accelerated creep rates of copper single crystal specimens were measured during anodic dissolution in acetate buffer solutions at various temperatures in the range from 10 to 4O'C. Delay times are not strongly temperature dependent. Under conditions of constant stress, achieved by compensating for t