𝔖 Bobbio Scriptorium
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Comment on “Effect of applied potential and surface dissolution on the creep behavior of copper”

✍ Scribed by I.R Kramer


Book ID
116058657
Publisher
Elsevier Science
Year
1974
Weight
150 KB
Volume
8
Category
Article
ISSN
0036-9748

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📜 SIMILAR VOLUMES


The effect of surface dissolution on the
✍ C.J. Van Der Wekken 📂 Article 📅 1977 🏛 Elsevier Science ⚖ 760 KB

Accelerated creep rates of copper single crystal specimens were measured during anodic dissolution in acetate buffer solutions at various temperatures in the range from 10 to 4O'C. Delay times are not strongly temperature dependent. Under conditions of constant stress, achieved by compensating for t