✦ LIBER ✦

Effect of annealing on the surface microstructural evolution and the electromigration reliability of electroplated Cu films

✍ Scribed by S. H. Kang; Y. S. Obeng; M. A. Decker; M. Oh; S. M. Merchant; S. K. Karthikeyan; C. S. Seet; A. S. Oates

Book ID: 107452679
Publisher: Springer US
Year: 2001
Tongue: English
Weight: 930 KB
Volume: 30
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-001-0166-0

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of multistep annealing on mechani

Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

✍ A. K. Sikder; Ashok Kumar; P. Shukla; P. B. Zantye; M. Sanganaria 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 271 KB

The effect of annealing on the mechanica

The effect of annealing on the mechanical properties of electroplated NiFe films

✍ J. Tymowski; R. Kisiel 📂 Article 📅 1975 🏛 Elsevier Science ⚖ 585 KB

Annealing effects on the microstructure

Annealing effects on the microstructure of amorphous carbon nitride films

✍ X.C. Wang; Z.Q. Li; P. Wu; E.Y. Jiang; H.L. Bai 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 928 KB

The annealing influence on the rotationa

The annealing influence on the rotational hysteresis losses of nickel electroplated films

✍ Chiriac, H. ;Pop, Gh. 📂 Article 📅 1975 🏛 John Wiley and Sons 🌐 English ⚖ 184 KB

The effect of surface transport on the e

The effect of surface transport on the evolution of film microstructure in plasma etching and deposition

✍ Vivek K. Singh; Wayne Ford; Jorge Garcia-Colevatti 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 339 KB

Surface transport models proceeding via surface re-emission and surface diffusion are briefly described. The important dimensionless parameter for re-emission is the sticking probability, whereas for surface diffusion, profile evolution is governed by the Damkohler number. The results of our continu

Effect of annealing on the resistivity o

Effect of annealing on the resistivity of quench-condensed Cu and Cu(Fe) thin films

✍ P. J. Silvėrman; C. V. Briscoe 📂 Article 📅 1978 🏛 Springer US 🌐 English ⚖ 295 KB

Pure Cu and Cu(Fe) thin films containing ~0.1 and ~1.0 at % Fe were prepared by low-temperature deposition onto a liquid-helium-cooled substrate. The Cu (Fe ) films were annealed sequentially at approximately 17, 70, and 270 K. After each annealing stage the resistivity was measured down to ~l.5 K.