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Effect of annealing on the interfacial adhesion energy between electroless-plated Ni and polyimide

✍ Scribed by Sung-Cheol Park; Kyoung-Jin Min; Kyu Hwan Lee; Yongsoo Jeong; Young-Bae Park

Book ID: 107662098
Publisher: TechnoPress
Year: 2011
Tongue: English
Weight: 679 KB
Volume: 17
Category: Article
ISSN: 1598-9623
DOI: 10.1007/s12540-011-0215-z

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