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Effect of Ag content on the microstructure of Sn‐Ag‐Cu based solder alloys

✍ Scribed by Reid, M.; Punch, J.; Collins, M.; Ryan, C.

Book ID
124148704
Publisher
Emerald Group Publishing Limited
Year
2008
Tongue
English
Weight
450 KB
Volume
20
Category
Article
ISSN
0954-0911

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## Abstract Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na~2~SO~4~ solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag~3~Sn in t