Dry Etching Technology for Semiconductors

✍ Scribed by Kazuo Nojiri (auth.)

• Publisher: Springer International Publishing
• Year: 2015
• Tongue: English
• Leaves: 126
• Edition: 1
• Category: Library

✦ Synopsis

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

✦ Table of Contents

Front Matter....Pages i-xiii
The Contribution of Dry Etching Technology to Progress in Semiconductor Integrated Circuits....Pages 1-9
Mechanism of Dry Etching....Pages 11-30
Dry Etching of Various Materials....Pages 31-55
Dry Etching Equipment....Pages 57-71
Dry Etching Damage....Pages 73-89
Latest Dry Etching Technologies....Pages 91-112
Future Challenges and Outlook for Dry Etching Technology....Pages 113-116

✦ Subjects

Circuits and Systems; Electronic Circuits and Devices; Semiconductors