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Direct bonding of silicon wafers with the concurrent formation of diffusion layers

✍ Scribed by I. V. Grekhov; L. S. Kostina; T. S. Argunova; E. I. Belyakova; N. M. Shmidt; K. B. Kostin; E. D. Kim; S. Ch. Kim

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

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✍ V. B. Voronkov; E. G. Guk; V. A. Kozlov; V. B. Shuman 📂 Article 📅 1998 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 41 KB

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Direct bonding of silicon carbide wafers

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Applications of the silicon wafer direct

✍ K. Furukawa; A. Nakagawa 📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 526 KB

Use of direct wafer bonding of silicon f

✍ V. B. Voronkov; E. G. Guk; V. A. Kozlov; M. Z. Shvarts; V. B. Shuman 📂 Article 📅 1998 🏛 Springer 🌐 English ⚖ 63 KB

Formation of insulating oxygen-containin

✍ O. Zinchuk; A. Saad; N. Drozdov; A. Fedotov; S. Kobeleva; A. Mazanik; A. Patryn; 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 206 KB