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Direct bonding of silicon carbide wafers with a regular relief at the interface

✍ Scribed by I. V. Grekhov; L. S. Kostina; T. S. Argunova; E. I. Belyakova; J. H. Je; P. A. Ivanov; T. P. Samsonova

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Direct bonding of silicon wafers with a

✍ V. B. Voronkov; E. G. Guk; V. A. Kozlov; V. B. Shuman 📂 Article 📅 1998 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 41 KB

Direct bonding of silicon wafers with th

✍ I. V. Grekhov; L. S. Kostina; T. S. Argunova; E. I. Belyakova; N. M. Shmidt; K. 📂 Article 📅 2001 🏛 Springer 🌐 English ⚖ 491 KB

A test structure for characterization of

✍ R. Knechtel; M. Knaup; J. Bagdahn 📂 Article 📅 2005 🏛 Springer-Verlag 🌐 English ⚖ 412 KB

Tungsten thin-film deposition on a silic

✍ S. V. Plyushcheva; G. M. Mikhailov; L. G. Shabel’nikov; S. Yu. Shapoval 📂 Article 📅 2009 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 195 KB

Synthesis of Silicon Carbide Nanostructu

✍ C.-H. Wang; Y.-H. Chang; M.-Y. Yen; C.-W. Peng; C.-Y. Lee; H.-T. Chiu 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 277 KB 👁 2 views

Transient isothermal generation at the s

📂 Article 📅 1976 🏛 Elsevier Science 🌐 English ⚖ 124 KB