The cure process of mixtures of a DGEBA-type epoxy resin and ethylenediamine, in different molar ratios, was investigated by dielectrometry in a wide frequency range, 103-2 10'' Hz, at three temperatures, 25,60, and 70Β°C. Two relaxation processes were found whose relevant parameters were obtained by
Dielectric cure monitoring and optimization of film adhesives
β Scribed by M. Ungarish; R. Joseph; J. Vittoser; E. Zur; S. Kenig
- Book ID
- 107893661
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 474 KB
- Volume
- 11
- Category
- Article
- ISSN
- 0143-7496
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## Abstract The cure process of a BADGE (diglycidyl ether of bisphenolβA) resin (Epon 828) and ethylenediamine has been investigated by means of calorimetry and dielectrometry in the microwave region (10^7^β10^10^ Hz) in the temperature range 50 to 70Β°C. Kinetic data from calorimetry were analyzed