The cure process of mixtures of a DGEBA-type epoxy resin and ethylenediamine, in different molar ratios, was investigated by dielectrometry in a wide frequency range, 103-2 10'' Hz, at three temperatures, 25,60, and 70Β°C. Two relaxation processes were found whose relevant parameters were obtained by
Calorimetric and microwave dielectric monitoring of epoxy resin cure
β Scribed by Simona Carrozzino; Giovanni Levita; Pierangelo Rolla; Elpidio Tombari
- Publisher
- Society for Plastic Engineers
- Year
- 1990
- Tongue
- English
- Weight
- 790 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0032-3888
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β¦ Synopsis
Abstract
The cure process of a BADGE (diglycidyl ether of bisphenolβA) resin (Epon 828) and ethylenediamine has been investigated by means of calorimetry and dielectrometry in the microwave region (10^7^β10^10^ Hz) in the temperature range 50 to 70Β°C. Kinetic data from calorimetry were analyzed in detail. An overall kinetic order of 2.5 has been obtained. The time domain reflectometry (TDR) has been used to characterize pure components and their mixtures. Cure monitoring was carried out with both TDR and a cavity method at fixed frequency (9.5 Γ 10^9^ Hz). A very good agreement was obtained between the reaction rate as measured by calorimetry and the rate of decrease of dielectric constants up to very high conversion. This was explained by admitting that the rates of disappearance of dielectric dipoles and of reactive species coincided.
π SIMILAR VOLUMES
The curing of a particular epoxy resin (digiycidylether of bisphenol-A) by three amino hardeners (4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulphone and 4,4'-diaminodiphenylether) is followed by dielectric measurements performed under microwave heating. The formation on heating of a molecular
The cure kinetics of four epoxy/amine systems including commercial RTM6 and F934 resins have been investigated under both isothermal and dynamic curing conditions. Differential Scanning Calorimetry (DSC) was the thermoanalytical technique used to determine the cure kinetics of these resin systems. T