𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Calorimetric and microwave dielectric monitoring of epoxy resin cure

✍ Scribed by Simona Carrozzino; Giovanni Levita; Pierangelo Rolla; Elpidio Tombari


Publisher
Society for Plastic Engineers
Year
1990
Tongue
English
Weight
790 KB
Volume
30
Category
Article
ISSN
0032-3888

No coin nor oath required. For personal study only.

✦ Synopsis


Abstract

The cure process of a BADGE (diglycidyl ether of bisphenol‐A) resin (Epon 828) and ethylenediamine has been investigated by means of calorimetry and dielectrometry in the microwave region (10^7^–10^10^ Hz) in the temperature range 50 to 70Β°C. Kinetic data from calorimetry were analyzed in detail. An overall kinetic order of 2.5 has been obtained. The time domain reflectometry (TDR) has been used to characterize pure components and their mixtures. Cure monitoring was carried out with both TDR and a cavity method at fixed frequency (9.5 Γ— 10^9^ Hz). A very good agreement was obtained between the reaction rate as measured by calorimetry and the rate of decrease of dielectric constants up to very high conversion. This was explained by admitting that the rates of disappearance of dielectric dipoles and of reactive species coincided.


πŸ“œ SIMILAR VOLUMES


Dielectric monitoring of epoxy cure
✍ G. Levita; A. Livi; P. A. Rolla; C. Culicchi πŸ“‚ Article πŸ“… 1996 πŸ› John Wiley and Sons 🌐 English βš– 534 KB

The cure process of mixtures of a DGEBA-type epoxy resin and ethylenediamine, in different molar ratios, was investigated by dielectrometry in a wide frequency range, 103-2 10'' Hz, at three temperatures, 25,60, and 70Β°C. Two relaxation processes were found whose relevant parameters were obtained by

Variations of the dielectric properties
✍ Michel Delmotte; Henri Jullien; Michel Ollivon πŸ“‚ Article πŸ“… 1991 πŸ› Elsevier Science 🌐 English βš– 517 KB

The curing of a particular epoxy resin (digiycidylether of bisphenol-A) by three amino hardeners (4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulphone and 4,4'-diaminodiphenylether) is followed by dielectric measurements performed under microwave heating. The formation on heating of a molecular

Cure modeling and monitoring of epoxy/am
✍ Panagiotis I. Karkanas; Ivana K. Partridge πŸ“‚ Article πŸ“… 2000 πŸ› John Wiley and Sons 🌐 English βš– 276 KB πŸ‘ 2 views

The cure kinetics of four epoxy/amine systems including commercial RTM6 and F934 resins have been investigated under both isothermal and dynamic curing conditions. Differential Scanning Calorimetry (DSC) was the thermoanalytical technique used to determine the cure kinetics of these resin systems. T