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Monitoring the cure of an epoxy-anhydride resin

✍ Scribed by Walter X. Zukas

Publisher
Society for Plastic Engineers
Year
1989
Tongue
English
Weight
599 KB
Volume
29
Category
Article
ISSN
0032-3888

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πŸ“œ SIMILAR VOLUMES

Calorimetric and microwave dielectric mo
Calorimetric and microwave dielectric monitoring of epoxy resin cure
✍ Simona Carrozzino; Giovanni Levita; Pierangelo Rolla; Elpidio Tombari πŸ“‚ Article πŸ“… 1990 πŸ› Society for Plastic Engineers 🌐 English βš– 790 KB

## Abstract The cure process of a BADGE (diglycidyl ether of bisphenol‐A) resin (Epon 828) and ethylenediamine has been investigated by means of calorimetry and dielectrometry in the microwave region (10^7^–10^10^ Hz) in the temperature range 50 to 70Β°C. Kinetic data from calorimetry were analyzed

Thermal scanning rheometric analysis of
Thermal scanning rheometric analysis of curing kinetic of an epoxy resin. I. An anhydride as curing agent
✍ J. Ampudia; E. Larrauri; E. M. Gil; M. RodrΓ­guez; L. M. LeΓ³n πŸ“‚ Article πŸ“… 1999 πŸ› John Wiley and Sons 🌐 English βš– 150 KB πŸ‘ 2 views

The curing reaction of the system diglycidyl ether of bisphenol A (DGEBA), an organic anhydride (HMTPA), as curing agent and a tertiary amine (DMP 30) as initiator has been studied by Thermal Scanning Rheometry (TSR) under isothermal conditions. The gel time, which is defined by several different cr