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Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes

✍ Scribed by Y. D. Han; S. M. L. Nai; H. Y. Jing; L. Y. Xu; C. M. Tan; J. Wei

Publisher
Springer US
Year
2010
Tongue
English
Weight
484 KB
Volume
22
Category
Article
ISSN
0957-4522

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