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Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures

✍ Scribed by F. Chen; J. Gill; D. Harmon; T. Sullivan; A. Strong; B. Li; H. Rathore; D. Edelstein

Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 590 KB
Volume: 46
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2005.05.016

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