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Expanding thermal plasma for low-k dielectrics: engineering the film chemistry by means of specific dissociation paths in the plasma

✍ Scribed by M. Creatore; W.M.M. Kessels; Y. Barrell; J. Benedikt; M.C.M. van de Sanden


Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
221 KB
Volume
7
Category
Article
ISSN
1369-8001

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