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Deposition, structure and hardness of Ti–Cu–N hard films prepared by pulse biased arc ion plating

✍ Scribed by X.Q. Wang; Y.H. Zhao; B.H. Yu; J.Q. Xiao; F.Q. Li

Book ID: 113940904
Publisher: Elsevier Science
Year: 2011
Tongue: English
Weight: 1002 KB
Volume: 86
Category: Article
ISSN: 0042-207X
DOI: 10.1016/j.vacuum.2011.08.015

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