𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Deposition by pulsed erosion of nickel and aluminum on copper

✍ Scribed by J. Langner; J. Piekoszewski; C. Pochrybniak; F. Rosatelli; S. Rizzo; J. Kucinski; A. Miotello; L. Guzman; P. Lazzeri

Publisher
Elsevier Science
Year
1994
Tongue
English
Weight
539 KB
Volume
66
Category
Article
ISSN
0257-8972

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Breakaway properties of film formed on c
Breakaway properties of film formed on copper and copper alloys in erosion–corrosion by mass transfer equation
✍ A. Yabuki; M. Murakami πŸ“‚ Article πŸ“… 2008 πŸ› John Wiley and Sons 🌐 German βš– 195 KB

## Abstract Erosion–corrosion tests on copper and three types of copper alloys in a 1 wt% solution of CuCl~2~ were carried out at various flow velocities using a jet‐in‐slit testing apparatus, which is capable of reproducing various hydrodynamic conditions. A damage profile of a specimen was develo

Dependence of deposition characteristics
Dependence of deposition characteristics by copper chemical vapor deposition on gas flow shape
✍ Akiko Kobayashi; Atsushi Sekiguchi; Kei Ikeda; Osamu Okada; Tomoaki Koide πŸ“‚ Article πŸ“… 2000 πŸ› John Wiley and Sons 🌐 English βš– 531 KB

When copper interconnection is applied in practical ULSI devices, it is required to fill holes and trenches with high aspect ratios with copper. A high deposition rate of 100 nm/min as well as complete gap filling at an aspect ratio of 3 was obtained in deposition of copper by chemical vapor deposit