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Curing Kinetics and Thermal Property Characterization of Bisphenol-F Epoxy Resin and MeTHPA System

✍ Scribed by H. Zhao; J. Gao; Y. Li; S. Shen

Book ID
111559999
Publisher
Springer Netherlands
Year
2003
Tongue
English
Weight
188 KB
Volume
74
Category
Article
ISSN
0022-5215

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πŸ“œ SIMILAR VOLUMES

Curing kinetics and thermal property cha
Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system
✍ Jungang Gao; Hongchi Zhao; Yanfang Li πŸ“‚ Article πŸ“… 2002 πŸ› John Wiley and Sons 🌐 English βš– 118 KB

## Abstract The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with __N,N__‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure