Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines
โ Scribed by Parveen Khurana; S Aggarwal; A. K. Narula; Veena Choudhary
- Publisher
- John Wiley and Sons
- Year
- 2003
- Tongue
- English
- Weight
- 123 KB
- Volume
- 87
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinet
Epoxy resin (diglycidyl ether of bisphenol A, DGEBA)/cyanate ester mixtures were cured with a curing agent, 4,4-diaminodiphenylsulfone, and the effect of cyanate ester resin on the cure behavior and thermal stability in the epoxy resin was investigated with a Fourier transform infrared spectrometer,