Studies of the curing kinetics and thermal stability of epoxy resins using a mixture of amines and anhydrides
β Scribed by Ritu Jain; Parveen Kukreja; A. K. Narula; Veena Chaudhary
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 102 KB
- Volume
- 100
- Category
- Article
- ISSN
- 0021-8995
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The cure kinetics of four epoxy/amine systems including commercial RTM6 and F934 resins have been investigated under both isothermal and dynamic curing conditions. Differential Scanning Calorimetry (DSC) was the thermoanalytical technique used to determine the cure kinetics of these resin systems. T
## Abstract The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourierβtransform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC),
Epoxy resin (diglycidyl ether of bisphenol A, DGEBA)/cyanate ester mixtures were cured with a curing agent, 4,4-diaminodiphenylsulfone, and the effect of cyanate ester resin on the cure behavior and thermal stability in the epoxy resin was investigated with a Fourier transform infrared spectrometer,