Studies on curing kinetics and thermal behavior of phosphorylated epoxy resin in the presence of aromatic amide-amines
β Scribed by Geeta Durga; Parveen Kukreja; A. K. Narula
- Publisher
- John Wiley and Sons
- Year
- 2010
- Tongue
- English
- Weight
- 195 KB
- Volume
- 118
- Category
- Article
- ISSN
- 0021-8995
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The epoxy resin containing a typical mesogenic group such as biphenol was cured with catechol novolak and aromatic diamines which have neighboring active hydrogens. In the biphenol-type epoxy resin cured with catechol novolak, 4,4-diaminodiphenylmethane, and p-phenylenediamine (PPD), the glass-rubbe
Epoxy resin (diglycidyl ether of bisphenol A, DGEBA)/cyanate ester mixtures were cured with a curing agent, 4,4-diaminodiphenylsulfone, and the effect of cyanate ester resin on the cure behavior and thermal stability in the epoxy resin was investigated with a Fourier transform infrared spectrometer,