✦ LIBER ✦

Curing behavior and thermal property of epoxy resin with boron-containing phenol-formaldehyde resin

✍ Scribed by Jungang Gao; Yanfang Liu

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 196 KB
Volume: 76
Category: Article
ISSN: 0021-8995
DOI: 10.1002/(sici)1097-4628(20000516)76:7<1054::aid-app9>3.0.co;2-z

No coin nor oath required. For personal study only.

✦ Synopsis

The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T g s) were measured for the BPAER-BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T g s, the curing process and the thermal property of BPAER-BPFR are clearly illustrated.

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