The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinet
Thermal behavior and properties of naphthalene containing bismaleimide–triazine resins
✍ Scribed by Hann-Jang Hwang; Chun-Shan Wang
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 214 KB
- Volume
- 68
- Category
- Article
- ISSN
- 0021-8995
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✦ Synopsis
A series of bismaleimidertriazine (BT) resins were prepared from various dicyanate esters and 2,7-bis(4-maleimidophenoxy)naphthalene (BMPN), which contains a naphthalene group and an aryl ether linkage in the backbone. Their curing behaviors were characterized by differential scanning calorimetry. The exotherm temperature and polymerization reactivity were strongly affected by the chemical structure of the various dicyanate ester monomer. Thermal behaviors were investigated by thermogravimetric analyses and dynamic mechanical analyses. The glass transition temperatures ( T g ) of these cured resins with bismaleimide/dicyanate ester at the 1/2 molar ratio were in the range of 250-322ЊC, and exhibited excellent thermal stability up to 400ЊC in nitrogen. These results provided a structure-properties relationship for the cured bismaleimidertriazine resins.
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