✦ LIBER ✦

Creep of vaporization-deposited copper films

✍ Scribed by K. K. Ziling; V. Yu. Pchelkin

Book ID: 104972284
Publisher: SP MAIK Nauka/Interperiodica
Year: 1973
Tongue: English
Weight: 205 KB
Volume: 12
Category: Article
ISSN: 0021-8944
DOI: 10.1007/bf00851630

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Chemical Vapor Deposition of Copper Film

Chemical Vapor Deposition of Copper Films from Copper Dipivaloylmethanate in Hydrogen Atmosphere

✍ V. V. Bakovets; T. M. Levashova; I. P. Dolgovesova; V. S. Danilovich 📂 Article 📅 2002 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 307 KB

Microstructures of copper thin films pre

Microstructures of copper thin films prepared by chemical vapor deposition

✍ Nam-Ihn Cho; Dong Il Park 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 311 KB

Nanoindentation creep of plasma-enhanced

Nanoindentation creep of plasma-enhanced chemical vapor deposited silicon oxide thin films

✍ Zhiqiang Cao; Xin Zhang 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 424 KB

Nanomechanical response and creep behavi

Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test

✍ Shou-Yi Chang; Yu-Shuien Lee; Ting-Kui Chang 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 302 KB

Chemical vapor deposition of copper thin

Chemical vapor deposition of copper thin films for multi-level interconnections

✍ Nam-Ihn Cho; H. Gin Nam; Yong Choi; Jong-Soo Yang 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 256 KB

Copper thin films were prepared by a metal organic chemical vapor deposition technology on top of TiN / Si substrates, and the films were examined by varying the experimental substrate temperature and copper source vapor pressure. Emerging semiconductor sub-quarter-micron technologies require a mult

The structure of vapor-deposited copper

✍ R.W. Bauer; A.M. Schwartzman; C. D'Antonio 📂 Article 📅 1968 🏛 Elsevier Science 🌐 English ⚖ 792 KB