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Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test

✍ Scribed by Shou-Yi Chang; Yu-Shuien Lee; Ting-Kui Chang


Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
302 KB
Volume
423
Category
Article
ISSN
0921-5093

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