Microstructures of copper thin films prepared by chemical vapor deposition
โ Scribed by Nam-Ihn Cho; Dong Il Park
- Book ID
- 114086212
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 311 KB
- Volume
- 308-309
- Category
- Article
- ISSN
- 0040-6090
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๐ SIMILAR VOLUMES
Copper thin films were prepared by a low-temperature atmospheric-pressure chemical vapour deposition method. The raw material was copper dipivalylmethanate which is volatile and thermally stable. At a reaction temperature above 220 ~ polycrystalline copper films can be obtained by hydrogen reduction
Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (11) acetylacetonate. At a reaction temperature above 220 ~ polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity