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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

✍ Scribed by K. Nogita; C. M. Gourlay; T. Nishimura

Book ID: 107524439
Publisher: The Minerals, Metals & Materials Society
Year: 2009
Tongue: English
Weight: 646 KB
Volume: 61
Category: Article
ISSN: 1047-4838
DOI: 10.1007/s11837-009-0087-6

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