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Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

✍ Scribed by Jeong-Won Yoon; Young-Ho Lee; Dae-Gon Kim; Han-Byul Kang; Su-Jeong Suh; Cheol-Woong Yang; Chang-Bae Lee; Jong-Man Jung; Choong-Sik Yoo; Seung-Boo Jung

Book ID: 116597823
Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 439 KB
Volume: 381
Category: Article
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2004.03.076

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