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Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate

✍ Scribed by Hiroshi Nishikawa; Jin Yu Piao; Tadashi Takemoto

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Solder/Substrate Interfacial Reactions i

✍ H. Yu; V. Vuorinen; J. K. Kivilahti 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 538 KB

Investigation of interfacial reactions b

✍ Jeong-Won Yoon; Seung-Boo Jung 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 899 KB

Effect of adding Ce on interfacial react

✍ Lu, Bin ;Li, Hui ;Wang, Juan-hui ;Zhu, Hua-wei ;Jiao, Xian-he 📂 Article 📅 2008 🏛 Chinese Electronic Periodical Services 🌐 English ⚖ 933 KB

Interfacial reactions between liquid Sn3

✍ R. W. Wu; L. C. Tsao; S. Y. Chang; C. C. Jain; R. S. Chen 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 739 KB

Interfacial Reactions Between Pb-Free So

✍ Yee-Wen Yen; Wei-Kai Liou; Hong-Yao Wei; Chiapyng Lee 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 615 KB

Cracking and phase stability in reaction

✍ K. Nogita; C. M. Gourlay; T. Nishimura 📂 Article 📅 2009 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 646 KB