✦ LIBER ✦

Compound semiconductor wafer characterisation

Book ID: 104366285
Publisher: Elsevier Science
Year: 2003
Tongue: English
Weight: 514 KB
Volume: 16
Category: Article
ISSN: 0961-1290
DOI: 10.1016/s0961-1290(03)00978-5

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Structural characterisation of amorphise

Structural characterisation of amorphised compound semiconductors

✍ M.C. Ridgway; C.J. Glover; K.M. Yu; G.J. Foran; T.W. Lee; Y. Moon; E. Yoon 📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 106 KB

Semiconductor wafer bonding

✍ Reiche, M. 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 648 KB

## Abstract When mirror‐polished, flat, and clean wafers are brought into contact, they are locally attracted to each other and adhere or bond. This phenomenon is known as semiconductor wafer bonding. Different adhesion forces (van der Waals forces, hydrogen bonding) are the reason for the bonding

Semiconductor wafer mapping

📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 809 KB

Semiconductor wafer bonding

✍ Dr. V. Lehmann; Dr. I. W. K. Ong; Prof. U. Gösele; Dr. R. Stengl; Dr. K. Mitani 📂 Article 📅 1990 🏛 John Wiley and Sons 🌐 English ⚖ 297 KB

Characterisation of reliability of compo

Characterisation of reliability of compound semiconductor devices using electrical pulses

✍ M. Brandt; V. Krozer; M. Schüβler; K.-H. Bock; H.-L. Hartnagel 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 343 KB

Compound characterisation

📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 48 KB