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Comments on "An analysis of the thermal response of power chip packages"

✍ Scribed by Harrett, T.

Book ID: 114595594
Publisher: IEEE
Year: 1986
Tongue: English
Weight: 116 KB
Volume: 33
Category: Article
ISSN: 0018-9383
DOI: 10.1109/t-ed.1986.22585

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