𝔖 Bobbio Scriptorium

✦ LIBER ✦

Thermal and mechanical analysis of high-power GaAs flip-chips on CVD diamond substrates

✍ Scribed by Brown, M.D.; Singh, S.B.; Malshe, A.P.; Gordon, M.H.; Schmidt, W.F.; Brown, W.D.

Book ID: 123456754
Publisher: Elsevier Science
Year: 1999
Tongue: English
Weight: 445 KB
Volume: 8
Category: Article
ISSN: 0925-9635
DOI: 10.1016/S0925-9635(99)00162-4

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

High temperature device simulation and t

High temperature device simulation and thermal characteristics of GaAs MESFETs on CVD diamond substrates

✍ L.H. Shu; A. Christou; D.F. Barbe 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 681 KB

High-temperature device performance and

High-temperature device performance and thermal characteristics of GaAs MESFETs on CVD diamond substrates

✍ L. H. Zhu; A. Christou; D. F. Barbe 📂 Article 📅 2000 🏛 John Wiley and Sons 🌐 English ⚖ 410 KB 👁 1 views

[IEEE 2011 Symposium on Photonics and Op

[IEEE 2011 Symposium on Photonics and Optoelectronics (SOPO 2011) - Wuhan, China (2011.05.16-2011.05.18)] 2011 Symposium on Photonics and Optoelectronics (SOPO) - Thermal Analysis of GaAs-Based High Power Laser Diodes Related to Degradation

✍ Qiao, Yanbin; Feng, Shiwei; Wang, Xiaowei; Ma, Xiaoyu; Xiong, Cong; Guo, Chunshe 📂 Article 📅 2011 🏛 IEEE ⚖ 288 KB

[IEEE 2009 10th International Conferene

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Sensitivity analysis of technological fabrication tolerances on the lifetime of flip-chip solder joints

✍ Eckert, Tilman; Tetzner, Kornelius; Bochow-Ness, Olaf; Muller, Wolfgang H.; Reic 📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 868 KB