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On-chip bus thermal analysis and optimisation

✍ Scribed by Wang, F.; De Bole, M.; Wu, X.; Xie, Y.; Vijaykrishnan, N.; Irwin, M.J.

Book ID: 117809977
Publisher: The Institution of Engineering and Technology
Year: 2007
Tongue: English
Weight: 660 KB
Volume: 1
Category: Article
ISSN: 1751-8601
DOI: 10.1049/iet-cdt:20060116

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