The facing targets sputtering (FTS) system, typical of plasma-free sputtering systems, was used to deposit aluminum thin films composed of very fine grains with a smooth surface, large hardness and low resistivity. When the argon gas pressure PAr was as low as 10-' Pa, the aluminum films deposited a
✦ LIBER ✦
CoCr thin film preparation by facing targets sputtering
✍ Scribed by Yoshiro Niimura; Shigeki Nakagawa; Masahiko Naoe
- Publisher
- Elsevier Science
- Year
- 1988
- Weight
- 331 KB
- Volume
- 98
- Category
- Article
- ISSN
- 0025-5416
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