<p><STRONG>Interconnection Noise in VLSI Circuits</STRONG> addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. It is intended to provide the notions required for understanding the problem of modeling starting from physical argu
Circuits, Interconnections, and Packaging for Vlsi
โ Scribed by H. B. Bakoglu
- Publisher
- Addison Wesley Longman Publishing Co
- Year
- 1990
- Tongue
- English
- Leaves
- 540
- Category
- Library
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
nterconnection Noise in VLSI Circuits addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. It is intended to provide the notions required for understanding the problem of modeling starting from physical arguments, so that it is
<P>Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues
This book provides detailed information on the interconnect RC and layut extraction in integrated circuit chips. The RC and layout extraction is a part of the job in the physical design and timing analysis for high-speed circuit design. The accuracy of interconnects RC model as well as the extracted
<p><em>On Optimal Interconnections for VLSI</em> describes, from a geometric perspective, algorithms for high-performance, high-density interconnections during the global and detailed routing phases of circuit layout. First, the book addresses area minimization, with a focus on near-optimal approxim