Integrated circuit packaging, assembly, and interconnections

✍ Scribed by William Greig

• Publisher: Springer
• Year: 2006
• Tongue: English
• Leaves: 312
• Series: Springer Series in Advanced Microelectronics
• Category: Library

✦ Synopsis

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.

The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.

Integrated Circuit Packaging, Assembly and Interconnections is an introduction, a review and an update of packaging technologies.

✦ Table of Contents

Front-cover......Page 1
Front-matter......Page 2
Table of Contents......Page 6
List of Figures......Page 11
List of Tables......Page 18
Preface......Page 20
Acknowledgements......Page 22
1 Electronic Manufacturing and the Integrated Circuit......Page 24
2 Integrated Circuit Manufacturing: A Technology Resource......Page 38
3 Packaging the IC—Single Chip Packaging......Page 53
4 The Chip Scale Package......Page 68
5 Multichip Packaging......Page 81
6 Known Good Die (KGD)......Page 101
7 Packaging Options—Chip on Board......Page 113
8 Chip & Wire Assembly......Page 122
9 Tape Automated Bonding—TAB......Page 148
10 Flip Chip—The Bumping Processes [1–4]......Page 161
11 Flip Chip Assembly......Page 186
12 HDI Substrate Manufacturing Technologies: Thin Film Technology......Page 209
13 HDI Substrate Manufacturing Technologies: Thick Film Technology......Page 237
14 HDI Substrate Manufacturing Technologies: Cofired Ceramic......Page 249
15 Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate......Page 261
Acronyms and Definitions......Page 277
Microelectronics Glossary......Page 281
Index......Page 305