Characterization of Integrated Circuit Packaging Materials

✍ Scribed by Thomas Moore (Eds.)

• Publisher: Newnes
• Year: 1993
• Tongue: English
• Leaves: 281
• Edition: Illustrated
• Category: Library

✦ Synopsis

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

✦ Table of Contents

Content:
MATERIALS CHARACTERIZATION SERIES, Page ii
Front Matter, Page iii
Dedication, Page iv
Copyright, Page iv
Foreword, Pages xi-xii, Walter H. Schroen
Preface to Series, Page xiii, C.R. Brundle, C.A. Evans Jr.
Preface, Pages xiv-xvi, Thomas M. Moore, Robert G. McKenna
Contributors, Pages xvii-xviii
1 - IC Package Reliability Testing, Pages 1-26, LAWRENCE C. WAGNER
2 - Mold Compound Adhesion and Strength, Pages 27-55, SAMUEL S. KIM
3 - Mechanical Stress in IC Packages, Pages 57-77, DARVIN R. EDWARDS, STEVEN K. GROOTHUIS
4 - Moisture Sensitivity and Delamination, Pages 79-96, THOMAS M. MOORE, ROBERT G. McKENNA, SHAWN J. KELSALL
5 - Thermal Management, Pages 97-119, MOSTAFA AGHAZEDEH
6 - Electrical Performance of IC Packages, Pages 121-143, ERIC BOGATIN
7 - Solderability of Integrated Circuits, Pages 145-166, JAMES A. KARGOL, ANTHONY M. PETRUCCI, TIMOTHY M. McGUIGGAN
8 - Hermeticity and Joining in Ceramic IC Packages, Pages 167-185, STEPHEN R. MARTIN
9 - Advanced Interconnect Technologies, Pages 187-207, ROBERT G. McKENNA, THOMAS M. MOORE
Appendix - Technique Summaries, Page 208
1 - Acoustic Microscopy (C-AM), Pages 209-212, THOMAS M. MOORE
2 - Atomic Absorption Spectrometry (AAS), Page 213, THOMAS M. MOORE
3 - Auger Electron Spectroscopy (AES), Page 214
4 - Ceramic Plate Test (CPT) for Evaluating the Solderability of IC Devices, Pages 215-217, TIMOTHY McGUIGGAN
5 - Coulometric Method for Solderability Evaluation, Pages 218-221, KUAN-SHAUR LEI
6 - Decapsulation Techniques, Pages 222-224, LAWRENCE C. WAGNER
7 - Differential Scanning Calorimetry (DSC), Pages 225-226, SAMUEL S. KIM
8 - Dynamic Mechanical Analysis, Pages 227-228, HERBERT J. MOLTZAN
9 - Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS), Page 229
10 - Electron Probe X-Ray Microanalysis (EPMA), Page 230
11 - Energy-Dispersive X-Ray Spectroscopy (EDS), Page 231
12 - Finite Element Analysis (FEA), Pages 232-234, DARVIN R. EDWARDS, STEVE GROOTHUIS
13 - Fourier Transform Infrared Spectroscopy (FTIR), Page 235
14 - Inductively Coupled Plasma Mass Spectrometry (ICPMS), Page 236
15 - Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES), Page 237
16 - In Situ Strain Gauges, Pages 238-239, DARVIN EDWARDS, STEVE GROOTHUIS
17 - Ion Chromatography, Pages 240-242, T. TALASEK
18 - Mechanical Testing in IC Packaging, Pages 243-246, LAWRENCE C. WAGNER
19 - Scanning Electron Microscopy (SEM), Page 247
20 - Scanning Tunneling Microscopy (STM) and Scanning Force Microscopy (SFM), Page 248
21 - Static Secondary Ion Mass Spectrometry (Static SIMS), Page 249
22 - Thermogravimetric Analysis (TGA), Pages 250-251, HERBERT J. MOLTZAN
23 - Thermomechanical Analysis (TMA), Pages 252-254, HERBERT J. MOLTZAN
24 - Torsional Braid Analysis (TBA), Pages 255-257, SAMUEL S. KIM
25 - Wetting Balance Method to Evaluate the Solderability of IC Devices, Pages 258-259, TIMOTHY McGUIGGAN
26 - X-Ray Laminography, Pages 260-262, JOHN ADAMS
27 - X-Ray Photoelectron Spectroscopy (XPS)*, Page 263
28 - X-Ray Radiographic Inspection, Pages 264-266, JOSEPH COLANGELO
Index, Pages 267-274