𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Chemical mechanical polishing of silver damascene structures

✍ Scribed by M Hauder; J Gstöttner; L Gao; D Schmitt-Landsiedel

Book ID
104305731
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
487 KB
Volume
64
Category
Article
ISSN
0167-9317

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✦ Synopsis

Sub micron silver lines are patterned by applying chemical mechanical polishing (CMP). Dry etched SiO 2 trenches are filled with Ag by sputtering before removing surplus Ag by several CMP methods. Techniques using a slurry which focus on mechanical polishing have a problem in achieving planar removal of the metal. But with mainly chemical polishing a homogenous removal with proper embedded lines is possible. Thermally robust and smooth Ag metallization lines are the result of such a process.

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The unusual concentration effect in copper chemical mechanical polishing (CMP) is verified experimentally and operation-relevant models are derived. First, the well-known Preston equation is modified by taking the concentration effects into account. Next, a linear model is proposed to describe dishi