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Characterization of the rheological properties of a fast-curing epoxy-molding compound

✍ Scribed by Han, Sejin

Book ID: 121763336
Publisher: American Institute of Physics
Year: 1997
Tongue: English
Weight: 454 KB
Volume: 41
Category: Article
ISSN: 0148-6055
DOI: 10.1122/1.550809

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