A low-viscousity, highly thermally conductive epoxy molding compound (EMC)

✍ Scribed by Jong-Woo Bae; Wonho Kim; Seungchul Hwang; Young-Sun Choe; Sang-Hyun Lee

• Book ID: 105737043
• Publisher: The Polymer Society of Korea
• Year: 2004
• Tongue: English
• Weight: 442 KB
• Volume: 12
• Category: Article
• ISSN: 1598-5032
• DOI: 10.1007/bf03218998