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Characterization of low-k porous silica films incorporated with alkylene groups

โœ Scribed by Y. Uchida; T. Katoh; M. Oikawa


Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
198 KB
Volume
5
Category
Article
ISSN
1369-8001

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Electrical characterization of low-k fil
โœ Chang Young Kim; R. Navamathavan; Heon Ju Lee; Chi Kyu Choi ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 801 KB

Carbon doped SiOC(-H) films with low dielectric constant were deposited on p-type Si(100) substrates by using plasma enhanced chemical vapor deposition from dimethyldimethoxysilane [DMDMOS, C 4 H 12 O 2 Si] and oxygen gas as precursors. The SiOC(-H) films were deposited at different radio frequency