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Characterization of a diffusion barrier layer for molybdenum electrodes


Publisher
Elsevier Science
Year
2001
Weight
385 KB
Volume
42
Category
Article
ISSN
0140-6701

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Electrodeposition of CoMoP thin film as
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CoMoP thin films were fabricated by electrodeposition technique from citrate based bath onto Cu sheets for the application as diffusion barriers and metal capping layers in the copper interconnect technology. The study focused on the effect of (NH 4 ) 6 Mo 7 O 24 โ€ข4H 2 O concentrations in the platin