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Characterization and modeling of on-wafer single and multiple vias for CMOS RFICS

✍ Scribed by Xiaomeng Shi; Kiat Seng Yeo; Manh Anh Do; Chirn Chye Boon

Book ID
102521870
Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
163 KB
Volume
50
Category
Article
ISSN
0895-2477

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✦ Synopsis

Abstract

Characterization of on‐wafer vias using a 0.18‐μm RF CMOS technology is presented. Equivalent resistance and inductance of a single via and multiple vias with different physical arrangements are extracted from full wave simulations up to 30 GHz. An equivalent circuit model with frequency‐independent components is proposed to model the frequency‐dependent characteristics of the vias. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 713–715, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23173

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