✦ LIBER ✦

Characterization, design and modeling of on-chip interleaved transformers in CMOS RFICs

✍ Scribed by Dan Zhao; Kiat Seng Yeo; Manh Anh Do; Chirn Chye Boon

Book ID: 106342789
Publisher: Springer
Year: 2010
Tongue: English
Weight: 1003 KB
Volume: 66
Category: Article
ISSN: 0925-1030
DOI: 10.1007/s10470-010-9519-z

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Characterization and modeling of on-wafe

Characterization and modeling of on-wafer single and multiple vias for CMOS RFICS

✍ Xiaomeng Shi; Kiat Seng Yeo; Manh Anh Do; Chirn Chye Boon 📂 Article 📅 2008 🏛 John Wiley and Sons 🌐 English ⚖ 163 KB

## Abstract Characterization of on‐wafer vias using a 0.18‐μm RF CMOS technology is presented. Equivalent resistance and inductance of a single via and multiple vias with different physical arrangements are extracted from full wave simulations up to 30 GHz. An equivalent circuit model with frequenc

Integrated Multilayered On-Chip Inductor

Integrated Multilayered On-Chip Inductors for Compact CMOS RFICs and Their Use in a Miniature Distributed Low-Noise-Amplifier Design for Ultra-Wideband Applications

✍ Chirala, M.K.; Xin Guan; Nguyen, C. 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 538 KB

[IEEE IEEE Radio Frequency Integrated Ci

[IEEE IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - Philadelphia, PA, USA (8-10 June 2003)] IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 - Design and modeling of a high-Q on-chip hairpin inductor for RFIC applications

✍ Wan Ni, ; Xiaojuen Yuan, ; Tretiakov, Y.V.; Groves, R.; Larson, L.E. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 257 KB

On-chip characterization of interconnect

On-chip characterization of interconnect parameters and time delay in 0.18 μm CMOS technology for ULSI circuit applications

✍ Hi-Deok Lee; Kim, D.M.; Myoung-Jun Jang 📂 Article 📅 2000 🏛 IEEE 🌐 English ⚖ 300 KB

Modeling, Design, and Characterization o

Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications

✍ Jian Lu, ; Hongwei Jia, ; Xuexin Wang, ; Padmanabhan, Karthik; Hurley, William G 📂 Article 📅 2010 🏛 IEEE 🌐 English ⚖ 795 KB

[IEEE 2001 IEEE Radio Frequency Integrat

[IEEE 2001 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Phoenix, AZ, USA (20-22 May 2001)] 2001 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium (IEEE Cat. No.01CH37173) - Design and modeling of compact on-chip transformer/balun using multi-level metal windings for RF integrated circuits

✍ Tao Liang, ; Gillis, J.; Wang, D.; Cooper, P. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 346 KB