✦ LIBER ✦

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

✍ Scribed by Huo, Feng Wei; Guo, Dong Ming; Kang, Ren Ke; Jin, Zhu Ji

Book ID: 127023770
Publisher: Trans Tech Publications, Ltd.
Year: 2008
Tongue: English
Weight: 501 KB
Volume: 389-390
Category: Article
ISSN: 1662-9795
DOI: 10.4028/www.scientific.net/kem.389-390.36

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