✦ LIBER ✦
Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding
✍ Scribed by Yinxia Zhang; Dong Wang; Wei Gao; Renke Kang
- Book ID
- 107669219
- Publisher
- Nonferrous Metals Society of China
- Year
- 2011
- Tongue
- English
- Weight
- 483 KB
- Volume
- 30
- Category
- Article
- ISSN
- 1001-0521
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