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Characteristics of reactively sputtered niobium nitride thin films as diffusion barriers for Cu metallization

✍ Scribed by C. Huang; C. Lai; P. Tsai; H. Huang; J. Lin; C. Lee

Book ID: 124149020
Publisher: The Korean Institute of Metals and Materials
Year: 2013
Tongue: English
Weight: 479 KB
Volume: 9
Category: Article
ISSN: 1738-8090
DOI: 10.1007/s13391-012-2173-0

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