Properties of reactively sputtered W–B–N thin film as a diffusion barrier for Cu metallization on Si

✍ Scribed by L. C. Leu; D. P. Norton; L. McElwee-White; T. J. Anderson

• Publisher: Springer
• Year: 2008
• Tongue: English
• Weight: 356 KB
• Volume: 94
• Category: Article
• ISSN: 1432-0630
• DOI: 10.1007/s00339-008-4961-9